Production capabilities and machine park
Information material for partners and strategic clients. A complete electronics manufacturing partner - from PCB design to the finished device.
A complete EMS partner in one place
Since 2016 we have been designing and manufacturing electronics: PCB design, coordination of PCB fabrication at verified external factories, component sourcing, surface-mount (SMT) and through-hole (THT) assembly, box-build and testing. SMT assembly runs on two lines in a dedicated EPA (ESD-protected) zone. We source components from authorized distributors or assemble from materials consigned by the Client.
Production line and materials at every stage
Surface-mount assembly (SMT) runs on two lines in the EPA zone. The first is fully automated. The second - built around a semi-automatic stencil printer and a Pick&Place machine - is not integrated with the automatic line and is used for prototypes and short runs. Both lines use the same solder paste. Through-hole assembly (THT) with wave soldering is carried out separately.
What we can actually manufacture
SMT assembly
We cover the full miniaturization range: from 01005 to BGA, QFN and fine-pitch, with a consistent printing, placement and inspection process. Automatic assembly also covers large PCB formats, up to 1000 × 520 mm.
THT assembly / wave soldering
In-house through-hole capability: an automatic wave for continuous production and a dip soldering station for larger boards and shorter runs.
Quality control and traceability
AOI with declared process capability (GR&R<10% @6 Sigma, CPK>1.33), SPC and code reading. The machine supports data export to MES. Assembly to the IPC-A-610 standard.
Batch flexibility
Prototypes as well as small and medium series. Component sourcing on our side (authorized distributors) or assembly from consigned materials.
Machine specifications
Automatic SMT line EPA zone
| Machine | Key parameters |
|---|---|
| Mini loader 825W | capacity: 50 PCBs · format 50×50–450×250 mm |
| Stencil printer I.C.T-4034 | PCB up to 400×340 mm · repeatability ±0.01 mm · printing accuracy: ±0.025 mm · 2 heads · 2D inspection · SPI closed-loop · pneumatic table |
| Pick&Place Charmhigh RS10 | 10 heads · 45,000 CPH · ±0.033 mm, CPK ≥1.33 · 01005–BGA/QFN · placement area up to 1200×520 mm · vision: 10+1+2 cameras · ANC |
| Reflow oven 800S | 8 zones (8 top / 8 bottom) · max 300 °C · temp. accuracy ±1 °C · temp. uniformity ±2 °C · profiling with curve archiving · leaded and lead-free paste · BGA / CSP |
| AOI I.C.T AI-5146 | 12 Mpx camera · CNN algorithm · components from 01005 / IC 0.3 pitch · GR&R <10% @6 Sigma, CPK >1.33 · code reading · SPC · MES export |
| Unloader OK / NG | automatic sorting of good and rejected boards |
Second SMT assembly line EPA zone
| Machine | Key parameters |
|---|---|
| Semi-automatic stencil printer I.C.T-P3 | PCB up to 300×350 mm · accuracy ±0.05 mm · stencil 370×470–550×650 mm · PCB thickness 0.2–6 mm · manual stencil positioning · cycle <10 s · squeegee 0–200 mm/s |
| Pick&Place DSQ800-120F | 8 heads · positioning ±0.01 mm, repeatability ±0.02 mm · 20,000–26,000 CPH · 120 feeders · R/C/chip components up to 20 mm height · vision: 2 mark + 8 fast + 1 high-precision · max PCB 350×330 mm |
THT assembly / wave soldering Separate station
| Machine | Key parameters |
|---|---|
| Automatic wave YX200-WS | double wave · PCB up to 200 mm · preheating up to ~300 °C · 120 kg solder pot |
| Dip soldering station OB-S310 | PCB 30×30–420×320 mm · 80 kg pot · PID temp. control ±3 °C · soldering time 1–10 s |
Materials used in production
The entire soldering process is chemically consistent - the alloys, pastes and fluxes we use are compatible with each other. The composition of the solder alloy is verified by spectrometric testing at least once a year.
Inspection at every stage
- SPI closed-loop - solder paste print control in a closed feedback loop at the printing stage.
- Thermal profiling - an independent TWS Automation RT-04 profiler (4 channels, type K thermocouples) validates the oven profile against the paste specification; curves are archived.
- Post-assembly AOI - optical inspection of joints and components, CPK >1.33, GR&R <10% @6σ.
- X-ray inspection - for hidden joints (BGA / QFN), performed by an external partner according to project requirements.
- OK / NG sorting - automatic separation of good and rejected boards.
- Traceability - code reading (bar / QR), SPC, data export to an MES system available.
- Assembly standard - work to IPC-A-610; EPA zone across the entire SMT line.
- ESD packaging - each module is individually protected in a metallized ESD sleeve and then in anti-static bubble wrap; ESD protection continuity is maintained from the assembly line to shipment.
SNIKEYBOX - a complete terminal for contactless key dispensing
A partner building a vehicle-sharing system needed hardware for round-the-clock, unattended key dispensing. They had the app and web system on their side - they were looking for a supplier of the terminal's electronics and embedded software.
We designed the terminal's electronics from scratch - two controller types (a "slave" board and a main "master" controller) over several iterations - along with complete embedded software: firmware for both boards and a supervisor application on a Raspberry Pi. After prototype validation we launched series production.
We manufactured around 200 controllers. Terminals built on them have been operating in the field since 2019 - reliably, 24/7. We provide remote diagnostics: online status and connectivity monitoring of the devices.
NDA-covered project - BOM review and a cheaper equivalent at the quotation stage
A client from the industrial sector, whose name remains confidential under an NDA, provided documentation and a BOM for series production (a batch of 500 boards). Components were to be sourced by the manufacturer.
We review every BOM at the quotation stage for cost and availability. In this order we flagged the Vishay SFH6286-3 optocoupler (PLN 2.00/pc, 8 pcs per board) and proposed a 1:1 equivalent - the Würth Elektronik WL-OCPT phototransistor optocoupler (140814242000, PLN 0.41/pc). The same type of device, with no change in function.
The client accepted the substitute. With 8 pieces per board and a 500-piece run, the swap cut the order's BOM cost by about PLN 6,000 - from PLN 30,000 to PLN 24,000 (approx. 20%) - without touching the circuit design.
Selected assemblies and quality control
Sample boards assembled at MICROBOTIC and X-ray inspection images of BGA joints. Products covered by confidentiality are shown without customer markings.
Clients and reviews
Experience in industrial automation, IoT, heating control and niche devices, among others - from prototype to series. We also provide assembly for clients in the automotive and telecom industries (cooperation under NDA).
"Very good quality of the assembled circuits, fast quotation, transparent cost breakdown"
"delivers the product as ordered and meets the agreed deadline"
"2-layer PCBs made quickly and professionally"
How the process works
Let's talk about your project
Goździkowa 1, 87-126 Obrowo near Toruń, Poland
phone +48 883 932 156
bok@microbotic.tech · www.microbotic.tech